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Nanosecond laser annealing system LT-3100 PRODUCTS Laser System

ITEM INFO

SUB-MICROSECOND MELT ANNEALING ACHIEVES ONLY WAFER SURFACE HEANTING

LT-3100 is an advanced laser annealing system designed to overcome the technical limitations that have traditionally challenged thermal processing for cutting-edge semiconductor devices. With its proprietary UV laser technology, LT-3100 enables highly controlled melt-based treatments ideal for dopant activation, thin-film crystallization, defect repair, surface smoothing, and 3D stacking applications.

The system achieves ultra-fast temperature ramp-up and ramp-down cycles of under 200 nanoseconds. Its step-and-repeat architecture ensures exceptionally uniform processing across any wafer size, including small-diameter power device wafers and ultra-thin wafers below 40 µm, making it an ideal solution for a wide range of advanced device manufacturers.

Equipped with a sophisticated real-time monitoring function, LT-3100 provides precise visibility into laser process behavior, supporting both stable mass-production operation and application-specific optimization.

For process development, the system features a unique tool that allows hundreds of process conditions to be applied to a single wafer simultaneously. This capability dramatically reduces the time and cost required for evaluating and optimizing processing parameters.

POINT

Product FeaturesPICK UP

  • Ultra-low thermal budget
  • High activation by melt-annealing
  • Sub-micro second annealing
  • Full device exposure
  • High throughput
  • Applicable to a variety of applications